NFC
High Frequency products for mobile Near Field Communication
Mobile Phone Sticker
Matt finished mobile phone sticker with metal shielding for NFC application.
- Mechanical Dimensions
- Chip Type
- Electrical
- Material
- Operating Temperature
- Peak Storage Temperature
- Protection Class
Dimensions (L x W):
48mm x 25mm
44mm x 22mm
28mm x 19mm
Thickness:
0.69mm (includes silicon paper)
NXP, Infineon
Customer consigned chip
High frequency
Copper wire antenna
SES module
PVC/PETG
Ferrite
Adhesive backing
-25°C ~ +50°C
-25°C ~ +50°C
IP67
Pre-Punch Mobile Phone Sticker
Matt finished card containing pre-punched sticker using SES module and antenna.
- Mechanical Dimensions
- Chip Type
- Electrical
- Material
- Operating Temperature
- Peak Storage Temperature
- Protection Class
Dimensions (L x W): 54mm x 86mm
Sticker Size
48mm x 25mm/44mm x 22mm/28mm x 19mm
Thickness:
0.69mm (includes silicon paper)
NXP, Infineon
Customer consigned chip
High frequency
Copper wire antenna
SES module
PVC/PETG
-25°C ~ +50°C
-25°C ~ +50°C
IP67
